XIN Feng1, ZHANG Xiaohua2 , HU Yuehui3, CHEN Yichuan4
(School of Mechanical and Electronic Engineering, Jingdezhen Ceramic Institute, Jingdezhen 333403, Jiangxi, China)
Abstract: With the updating of electronics and information technology, microelectronics and solid state electronics have gotten high-speed development, thus contributing to the thin film materials widely used in different fields. The high-property thin films in turn directly promote the information technology’s soaring. The rapid integration and miniaturization of electronics demand that electronic products have the high-speed, micro-thin and highly reliable characteristics; meanwhile, they must be compatible with microelectronic technology. Thin film materials just meet the highly integrated multilayer wiring and other technical requirements. In this paper, the fabrication methods of thin film are introduced, their advantages and disadvantages compared. At the same time, the categories, latest research progress and application prospects of functional thin films are also introduced.
Key words: functional thin film; thin film technology; fabrication method; surface treatment