YAO Zhongying, CHANG Yiwen, CUI Ge, ZHANG Hongbo, REN Ruikang, REN Jiale, KUANG Fenghua
(Ceramics Science Institute, China Building Materials Academy, Beijing 100024, China)

Abstract: With the rapid development of integrated circuit and semiconductor industries, ceramic substrates with high surface accuracy and low roughness have become the best choice for packaging substrates, where the polishing process, as the most critical step in the production process, determines the overall quality of the of ceramic substrates. Focusing on the basic principles and application scope of common polishing technologies for ceramic substrates, including chemical mechanical polishing, abrasive flow polishing, ultrasonic vibration assisted abrasive flow polishing, electrophoretic polishing, electrolytic polishing, and magnetorheological polishing, this paper was aimed to summarize the commonly used polishing technologies and their research status for ceramic substrates, such as alumina, silicon nitride, silicon carbide, beryllium oxide and aluminum nitride. Besides, the development trend of ceramic substrate polishing technology will be discussed.
Key words: ceramic substrate; polishing technology; alumina; silicon nitride; silicon carbide; beryllium oxide; aluminum nitride