ZHANG Xiaohua, XIN Feng, HU Yuehui, YANG Feng, CHEN Yichuan

(School of Mechanical and Electronic Engineering, Jingdezhen Ceramic Institute, Jingdezhen, Jiangxi 333403)

Abstract: The rapid integration and miniaturization of electronics demands that electronic products be high-speed, micro-thin and highly reliable. The core materials of the electronic components are functional ceramics with specific electric, magnetic, acoustic, optical, thermal and mechanical characteristics. The development trends of functional ceramic components are multi-layer, chip -based, integrated, modular and multi -functional, high -performance and low -cost. In the paper, the microwave dielectric, ferroelectric, piezoelectric, ferromagnetic, pyroelectric and pressure-sensitive ceramics are introduced.At the same time, the latest research progress and the possible application prospect are also introduced.

Key words  functional ceramics; microwave dielectric; ferroelectric; piezoelectrics; ferromagnetic; pyroelectricity