ZHANG Feng, WANG Guanghai, ZHANG Shichao, SUN Haoran, HU Chuanqi, CHEN Yufeng

(China Building Materials Academy, Beijing, 100024, China)

Abstract: In this paper, the high temperature binder was prepared by dissolving different components, such as silica, zirconium diboride and boron carbide. After low temperature (150 ℃ or less) curing, SiC samples were bonded by the binder. The samples were subjected to treat at different temperatures (400 ℃, 800 ℃, 1200 ℃, 1500 ℃) under an inert atmosphere. The microstructures of the samples were observed by optical microscope and scanning electron microscope. The effects of the modified filler and heat treatment temperature on the bond strength of the phenolic resin based adhesive were investigated. The results show that the bonding strength of the boron carbide modified phenolic resin based adhesive is high. When the heat treatment temperature is above 1200 ℃, the bond strength increases with the addition of boron carbide.

Key words: phenolic resin; modification; temperature; bond performance