LIU Xiongzhang, GUO Ran, LI Qingda, YI Xuemei
(School of Mechanical and Electronic Engineering, Northwest A & F University, Yangling 712100, Shaanxi, China)

Abstract: In view of the heat dissipation of high-power electronic devices, the research progress of silicon nitride ceramics as a heat sink material is reviewed. Then the effect of the main factors on the thermal conductivity, the preparation method, the sintering additives during sintering process, and the mechanical and dielectric properties of silicon nitride ceramics are detailedly discussed. Finally, the future prospect of silicon nitride ceramics as heat dissipation substrate material is predicted.

Key words: silicon nitride; thermal conductivity; heat dissipation substrate; mechanical properties