SHI Changhua, XIE En, LIU Wei, LI Ke

(Jingdezhen University, Jingdezhen, Jiangxi 333000)

Abstract: A new scheme has been designed to measure the temperature of ceramic kilns. We choose as the main control STC12LE5A60S2, a high-performance MCU that is completely compatible with 8051 MCU. The measuring tool is MAX31855, a transformer which can compensate at the cold end and export the thermocouple signal. The principles of SPI trunk communication interface of MAX31855 and STC12LE5A60S2 chip are introduced, and the modularized drivers of MAX31855 are designed, through which the temperature of ceramic kilns can be measured.

Key words  MCU; thermocouple; temperature compensation; MAX31855