XIE Yuezeng 1, RAO Delin 2, LIN Kehui 1, ZHANG Ruiyao 2, ZHANG Shuyan 2
(1. MarcoPolo Holdings Co., Ltd., Dongguan 523000, Guangdong, China; 2. Centre of Excellence for Advanced Materials, CEAM, Dongguan 523808, Guangdong, China)
Abstract: During the manufacturing process of porcelain tiles, residual stress is generated due to non-uniform temperature or non-uniform material (glaze and body). In recent years, with the rapid development of large size porcelain tiles, the influence of residual stress on their quality has attracted much attention. Though detailed analysis and discussion, the causes of porcelain tile residual stress and the main measurement methods are introduced, including the crack compliance method and the three-point bending method. The authors' work, high-speed hole-drilling method to measure the residual stress of large size porcelain tiles, is also introduced. The studies will provide a guarantee to improve the porcelain tile manufacturing process and produce high-quality large size porcelain tiles.
Key words: porcelain tile; residual stress; X-ray diffraction; crack compliance method; hole-drilling method