ZHANG Guanglei 1, HAO Ning 1, YANG Zhigang 1, ZHANG Cheng 1, JIN Huajiang 2, GAO Shan 2
(1. School of Materials Science and Engineering, Shijiazhuang Tiedao University, Shijiazhuang 050043, Hebei, China; 2. Hebei King Ceramic Electronic Technology Co. Ltd, Xingtai 055550, Hebei, China)
Abstract: With the development of electronic information technology, electronic components are being gradually developed in the direction of miniaturization, high integration, multi-function, low cost, etc. Therefore, higher requirements are put forward for the performance and process of electronic packaging ceramic materials. It was aimed to introduce research progress in electronic packaging ceramic materials and technology, by focusing on low temperature co-firing ceramic (LTCC) technology. Specifically, electronic packaging ceramic components (such as alumina-based ceramics) will be presented, with topics like influence of particles on sintering process and ceramic surface metallization. Practical application of electronic packaging ceramics are discussed and the future development and prospect are prospected.
Key words: electronic packaging; low temperature co-fired ceramics; surface metallization